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Electronics thermal management: how Ansys helps

In SWaP-constrained defense electronics, heat is usually the wall you hit first. Thermal simulation tells you whether a design survives the environment long before you build a thermal test rig.

Electronics thermal management simulation visualization

Illustrative simulation render. Actual studies are built to your geometry and requirements.

The Ansys tools that model it

Icepak — Purpose-built electronics-cooling CFD for chips, boards, and enclosures with detailed component libraries.
Fluent — Resolves the harder conjugate heat-transfer and airflow problems at system and enclosure scale.
Mechanical — Adds thermal stress, warpage, and thermal-cycling fatigue to the reliability picture.

Icepak ↗Fluent ↗Mechanical ↗

Who funds it

Programs that fund this work

Typical funders: DoD SBIR · ME Commons · DIU. Explore award sizes, deadlines, and direct links to every source in the Funding Finder.

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What we provide

Free to start

Free Ansys evaluation licenses for the tools above, free engineering support to apply them to your MVP, and a free check on your Ansys Startup Program eligibility. Software and engineering only, never application advice.

How the free offers work →

Talk it through

Simulating electronics thermal management? Let's get Ansys in your hands.

Tell us about your project — incorporated, in stealth, or still an idea — and we'll line up the right Ansys tools and an engineer to help you validate the physics.

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Relevant Ansys product pages: Icepak on ansys.com ↗ Fluent on ansys.com ↗ Mechanical on ansys.com ↗